Thermal Interface Materials
With the development of microprocessors toward higher power, larger chip, and higher frequency, heat dissipation is one of the central issues. Thermal interface materials (TIMs), which are used between the chip and the heat spreader or the heat sink, play an increasingly important role in microprocessor cooling. TIMs are products that conduct heat between two or more solid mating surfaces are cost-effective and energy-efficient passive thermal management solutions that help maintain recommended operating temperatures in electronic devices or components.
TIMs are considered a significant element of any efficient thermal management system. These materials are widely used in consumer and industrial electronic systems to ensure efficient heat dissipation and prevent overloads of local temperature. Some industries where TIMs find applications include telecommunications, servers, gaming, automotive, and aerospace.
There are several TIMs available to suit different electronics thermal management requirements. Snowlucky Co, Ltd. spcialize in Select the Right TIMs for Your Applicaion.
The most common Thermal Conductive Materials include:
Thermal Pad
Thermal Condutive Gap Pad-TF Series
A gap pad is a class of TIMs that fills "large gap” between heat generating and heat dissipating surfaces. Gap Pad often can cover multiple heat sources within an application(Absorb tolerance). Gap fillers are usually silicone based because silicone has many attractive properties such as surface wetting, high thermal stability, and physical inertness. Newer offerings can contain no silicone. The silicone matrix is filled with thermally conductive fillers - BN, ZnO, and alumina. These fillers make up the functional portion of the gap pad which gives it its thermal properties. Gap pad need to be relatively compliant to achieve high deflections without generating excess pressure within an application.
Features and Benifts
- Thermal Conductivity 2.0W/m·K～15W/m·K
- Very high compliancy for low stress applications
- Low thermal resistance even at low pressure
- Excellent surface wetting for low contact resistance
- Low Dielectric Constant
- Naturally tacky, needs no further adhesive coating
- Compliance: ROHS/REACH/UL-94 V0
- Operating Temperature:-55℃～170°C
- Low D3-D20 (< 20ppm) & Low Outgassing
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Application
- Telecom and Data Center
- Automotive electronics and control units
- Computer . Memory chip and Server
- Panel and Smart Phone
- Consumer Electronics, Flat Panel Displays
- LED Lighting
- New energy battery and inverter
- Power Supply
TF Series Thermal Pad Technical Specification
Gel-1 Compo.
Thermal Gel -1 Component-TGL Series
Snowlucky's TGL series thermal Gel has a very low thermal resistance,require no curing and can be dispensed over a heat generating component for effective cooling. TGL eliminate multiple thermal gap filler pad part sizes and their cross-linked gel structure provides superior long-term thermal stability and performance.
but they are cured to a partially cross-linked structure to reduce chances of pump-out issues. TGL series Gel is a substance used to promote better heat conduction between two surfaces and is commonly used between a microprocessor and heatsink.
Benifits Thermal Grease does not add mechanical strength to the bond between heat source and heat spreader. Its excellent surface wetting results in low interfacial resistance.
Features and Benifts
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Thermal conductivity 3.0～12.0 W/m·K
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The perfect combination of extremely low stress and low thermal resistance
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High weather resistance and reliability
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Fully cured, never dry
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Easy to dispense, good plasticity, can replace thermal conductive silicone grease
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Compliance: ROHS/REACH
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Application
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Automotive Electronic Control Unit (ECU)
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Power and semiconductor
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Memory and power modules
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Microprocessor/graphics processor
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Flat panel displays and consumer electronics
TGL Series Thermal Gel Technical Specification
Gel-2 Compo.
Thermal Gel -2 Components-TML Series
Snowlucky Technology TMG series is a cured-in-place thermally conductive liquid gap filling material that contains A and B part. Generally, the glue is applied on the customer site at a mixing ratio of 1:1. Prior to curing, the material maintains good thixotropic characteristics, and is easy to dispense. The curing method of the gel is divided into thermal curing and room temperature moisture curing. The physical state after curing is equivalent to the ultra-soft version of the thermal pad. Due to the on-site curing process and the application of automatic dispensing equipment, it is more suitable for large-scale mass production application scenarios.
Features and Benifts
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Thermal conductivity 2.0～6.0 W/m·K
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Various types of thermal conductivity are available for selection and customization
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Good liquidity, easy to operate
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Suitable for room temperature and heating curing
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Good electrical insulation, temperature and weather resistance
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RoHS compatible
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Application
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Consumer electronics, communication equipment
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Printed circuit board assembly, housing connection
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Automotive electronics
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Military electronic equipment
TML Series Two Components Thermal Gel Technical Specification
Thermal Insulator
Thermal Insulator-Tin Series
Thermally conductive electrically insulative material is an excellent dielectric material with good thermal performance consisting of a polyimide film or fiberglass coated with a ceramic-filled, high-temperature silicone rubber.This type of product is designed for high power component, and withstand high voltage. Products are with either polyimide or fiberglass reinforcement to protect pads against tear, cut-through and punctures.
Features and Benifts
- Substrate made from polyimide or fiberglass with good conductivity, insulation and high breakdown voltage(> 6,000 volts).
- Resistant to tears and cutting-through.
- Low thermal resistance.
- Smooth surface and high conformability.
- Single side PSA available for easy assembly.
- RoHS compliant, UL-94 V0 rating.
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Application
- Power supply AC/DC and Power semiconductors (To packages, M0SFETs and IGBTs)
- New Energy equipment & Inverter
- LED lighting
- Automated electronics and control units
- Speaker amplifier
TIN Series Thermally Conductive Insulator Technical Specification
Phase Change Pad
Phase Change Material-TPC Series
Thermal Interface Phase Change Materials are used to enhance thermal transfer between a hot component and a thermal solution like a heatsink. The first PCMs melted to a liquid state at temperatures between 50C-60C,so they take advantage of latent heat of fusion to absorb heat, but they change phase only once to allow for the material to fill up all nooks and crevices,this enables the component to run at a lower temperature whereby increase speed and extending life.
Features and Benifts
- Thermal conductivity range: 1 – 8 W/mK
- Low total thermal resistance
- High thermal reliability
- Thickness range: 0.125mm to 0.5mm
- Compliancy: UL 94V0, RoHs, REACH
- Easy to use; peel and stick format with top tabbed liners or automatable placement
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Features and Benifts
- Graphics Card
- Servers
- IGBTs
- Automotive
- Memory Modules
TPC Series Thermally Phase Change Material Technical Specification
Thermal Tap
Thermal Conductive Tap-TBA Series
As a heat sink attachment method, thermal tapes eliminate the need for external clamps, bringing down the overall hardware requirement. Snowlucly's thermal adhesive tape TBA series is a kind of pressure-sensitive thermal adhesive tape with excellent heat-conducting property. Its common use is between the heat source and heat sink. This thermal material possesses good thermal conductivity, high breakdown voltage, adhesion and conform ability. Product has release paper on the one side, and protection film on the other side. Die-cut is easy for process.
Features and Benifts
- 0.5～1.0W/m·K
- Providing a convenient, reliable, and cleaner way to bond heat component and heat sink.
- Suitable for high thermal conducting application between the heat and cooling components.
- RoHS Compliant
- Easy to use
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Application
- Consumer Electronics
- Telecommunication Hardware
- Power Supplies
- Audio Amplifiers
- LED & Ballast Lighting
- Battery Charging
- Inverters
TBA Series Thermally Conductive Tap Technical Specification
Thermal Potting
Thermal Conductive Potting Compound-SP Series
Snowlucky thermally conductive potting compund is a two-component thermally conductive RTV silicone sealant for insulating and protecting electrical and electronic components from application and environmental stresses. This rubber-like compound resists shock and vibration, intended for exclusion of moisture and corrosive agents. High conductivity makes SP potting compound suitable for electronic components or packaging requiring heat dissipation while sealed.
Features and Benifts
- Good liquidity, easy to operate
- Suitable for room temperature and heating curing
- Good electrical insulation, temperature and weather resistance
- Curing, no shrinkage, no heat generation
- Wide temperature range (-50℃~200℃)
- Waterproof, moisture-proof, non-corrosive
- RoHS compatible
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Application
- Power modules / Inverters
- LED Lighting
- Transformers / Ballasts
- Sensors product
- Electric control units
- Vehicle electronics
SP Series Thermally Conductive Potting Compound Technical Specification
Thermal Grease
Thermal Conductive Grease-SG Series
Help end pump out and ensure reliability and optimal performance when minimum bond line, constant pressure and ease of screen printing are mandated.Snowlucky Technology's SG grease is silicone-based thermal grease designed to solve overheating and reliability problems. It can thoroughly wet out contact surfaces to create a low thermal resistance, and can be used in pneumatic dispensing and screen printing systems. It is environmentally safe and reliable.
Features and Benifts
- Thoroughly wets out contact surfaces to create low thermal resistance
- Fully characterized long term reliability
- Unique formulas will not harden, dry out, settle, or oxidize.
- Can be used in pneumatic dispensing and screen printing systems.
- Environmentally friendly solution that meets regulatory requirements including RoHS and REACH
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Application
- Semiconductor Packaging
- Graphics Card,Memory Modules
- Notebooks,Desktops,Servers
- IGBTs and Power Supply
- Automotive
- LED Lighting
- Consumer electronics
SG Series Thermally Conductive Grease Technical Specification
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Consumer Silicon Products
9F Jiangsi Building, 4# Xintian Road,
Fuyong town, Baoan District,
Shenzhen , China.
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snow.xie@snowlucky.com
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